Specific Process Knowledge/Back-end processing/Hot Embosser: Difference between revisions

From LabAdviser
← Older editNewer edit →
VisualWikitext
Bghe (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
7,018 edits
No edit summary
Darcat (talk | contribs)
NLAB-Employees-701
26 edits
No edit summary
Line 34: Line 34:
|style="background:LightGrey; color:black"|  
|style="background:LightGrey; color:black"|  
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Purpose 1
*Hot Embossing
*Purpose 2
*Chip Bonding
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance

Revision as of 11:26, 26 February 2020

THIS PAGE IS UNDER CONSTRUCTION

Feedback to this page: click here

Name of equipment

Write a short description of the equipment(s).

File:Cluster1.jpg
Image(s) of the equipment(s)


The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:

Hot Embosser in LabManager

Process information

Link to process pages - e.g. one page for each material

Example:

Equipment performance and process related parameters

Equipment Equipment 1
Purpose
  • Hot Embossing
  • Chip Bonding
Performance Response 1
  • Performance range 1
  • Performance range 2
Response 2
  • Performance range
Process parameter range Parameter 1
  • Range
Parameter 2
  • Range
Substrates Batch size
  • # small samples
  • # 50 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
Allowed materials
  • Allowed material 1
  • Allowed material 2


Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Back-end_processing/Hot_Embosser&oldid=33498"