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Specific Process Knowledge/Etch/III-V RIE/III V RIE ETCHES: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
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Bghe (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
7,317 edits
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|10.6
|10.6
|''Done dec2019/jan2020 by Qugig@nanolab and bghe@nanolab''
|''Done dec2019/jan2020 by Qugig and bghe @nanolab''
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!Lower etch rate, medium selectivity to resist
!Lower etch rate, medium selectivity to resist
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|~12
|~12
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|''Done dec2019/jan2020 by Qugig@nanolab and bghe@nanolab'' [[/Details SiO2_100|Images and reproducibility]]
| [[/Details SiO2_100|Images and reproducibility]] ''Done dec2019/jan2020 by Qugig and bghe @nanolab''
|-
|-
!Si3N4Ti
!Si3N4Ti
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