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Specific Process Knowledge/Characterization/Profiler: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
7,317 edits
Bghe (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
7,317 edits
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*Step height measurements
*Step height measurements
*3D topographic measurements
*3D topographic measurements
*Thick and thin film thickness measurements in small spots (down to 4 µm)
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!style="background:silver; color:black;" align="left"|Posibilities  
!style="background:silver; color:black;" align="left"|Posibilities  
|style="background:LightGrey; color:black"|Confocal and interferometric profiling and reflectometry||style="background:WhiteSmoke; color:black"|
|style="background:LightGrey; color:black"|Interferometric profiling||style="background:WhiteSmoke; color:black"|
*Standard microscope imaging
*Standard microscope imaging
*Confocal imaging
*Confocal profiling
*PSI (Phase Shift Interferometry)
*PSI (Phase Shift Interferometry)
*VSI (Vertical Scanning Interferometry)
*WLI (White light Interferometry)
*High resolution thin film thickness measurement using reflectrometry
*Stitched scans  
*Stitched scans  
*Wafer mapping
*Wafer mapping
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|style="background:LightGrey; color:black"|Substrate size
|style="background:LightGrey; color:black"|Substrate size
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*Substrates no bigger than 150 mm x 150mm
*Substrates no bigger than 110 mm x 100mm
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