Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions
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* Bosch processes with etch and dep cycles each split into three | * Bosch processes with etch and dep cycles each split into three | ||
* Parameter ramping during process steps | * Parameter ramping during process steps | ||
* SOI option to reduce notching at buried | * SOI option to reduce notching at buried oxide layers | ||
* Picoscope monitoring | * Picoscope monitoring | ||
* Verity OES | * Verity OES | ||
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* Parameter ramping during process steps | * Parameter ramping during process steps | ||
* Picoscope monitoring | * Picoscope monitoring | ||
* SOI option to reduce notching at buried | * SOI option to reduce notching at buried oxide layers | ||
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* Bosch processes with etch and dep cycles each split into three | * Bosch processes with etch and dep cycles each split into three | ||