Specific Process Knowledge/Lithography/DUVStepperLithography: Difference between revisions
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*Positive DUV resist for spin coating in 1600-800nm thickness range [[Media:M35G_Danchip_intro.pdf|KRF M35G]]. | *Positive DUV resist for spin coating in 1600-800nm thickness range [[Media:M35G_Danchip_intro.pdf|KRF M35G]]. | ||
*Negative DUV resist for spin coating in 1400-800nm or diluted with EC Solvent in 1:1 in 400-200nm thickness range [[Media:UVN2300.pdf|UVN2300-0.8]]. | *Negative DUV resist for spin coating in 1400-800nm or diluted with EC Solvent in 1:1 in 400-200nm thickness range [[Media:UVN2300.pdf|UVN2300-0.8]]. | ||
===Quality Control (Q)=== | |||
'''THIS SECTION IS UNDER CONSTRUCTION''' [[Image:section under construction.jpg|70px]] | |||
{| border="1" cellspacing="2" cellpadding="2" colspan="3" | |||
|bgcolor="#98FB98" |'''Quality Control (QC) for Spin Coater: Gamma e-beam & UV - AR-P 6200.09 [[Image:section under construction.jpg|70px]] ''' | |||
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*[http://labmanager.dtu.dk/d4Show.php?id=5123&mach=359 The QC procedure for Spin Coater: Gamma e-beam & UV]<br> | |||
*[http://labmanager.dtu.dk/view_binary.php?fileId=4210 The newest QC data for Spin Coater: Gamma e-beam & UV] | |||
{| {{table}} | |||
| align="center" | | |||
{| border="1" cellspacing="1" cellpadding="2" align="center" style="width:400px" | |||
! QC Recipe: | |||
! (4325) DCH 100mm CSAR 250nm | |||
|- | |||
|Substrate size | |||
|4" | |||
|- | |||
| Resist volume | |||
|2 ml | |||
|- | |||
|Spin-off speed | |||
|2600 rpm | |||
|- | |||
|Spin-off time | |||
|60 s | |||
|- | |||
|Soft bake temperature | |||
|180°C, 1mm proximity | |||
|- | |||
|Soft bake time | |||
|180 s | |||
|- | |||
|} | |||
| align="center" valign="top"| | |||
{| border="2" cellspacing="1" cellpadding="2" align="center" style="width:400px" | |||
!QC limits | |||
!Spin Coater: Gamma UV e-beam & UV - AR-P 6200.09 | |||
|- | |||
|Nominal film thickness | |||
|250 nm | |||
|- | |||
|Film thickness deviation from nominal | |||
|<5% | |||
|- | |||
|Film thickness non-uniformity | |||
|<5% | |||
|- | |||
|} | |||
|- | |||
|} | |||
Spin-off speed will be adjusted if film thickness is outside the limit. | |||
|} | |||
===Standard processes=== | ===Standard processes=== | ||