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Specific Process Knowledge/Lithography/UVLithography: Difference between revisions

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** For dry etch or wet etch processes, investigate the resist etch rate of your process as this might limit the minimum thickness of your resist.
** For dry etch or wet etch processes, investigate the resist etch rate of your process as this might limit the minimum thickness of your resist.


*'''Exposure''': Choose which mask aligner you wish to use, and consider the exposure dose.
*'''Exposure''': Choose which aligner you wish to use, and consider the exposure dose.
** You can find a list of mask aligners <u>[[Specific_Process_Knowledge/Lithography/UVExposure|here]]</u>.
** You can find a list of mask aligners <u>[[Specific_Process_Knowledge/Lithography/UVExposure|here]]</u>.
** You can find information on dose <u>[[Specific_Process_Knowledge/Lithography/UVExposure_Dose|here]]</u>.
** You can find information on dose <u>[[Specific_Process_Knowledge/Lithography/UVExposure_Dose|here]]</u>.