Specific Process Knowledge/Lithography/UVLithography: Difference between revisions
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** For dry etch or wet etch processes, investigate the resist etch rate of your process as this might limit the minimum thickness of your resist. | ** For dry etch or wet etch processes, investigate the resist etch rate of your process as this might limit the minimum thickness of your resist. | ||
*'''Exposure''': Choose which | *'''Exposure''': Choose which aligner you wish to use, and consider the exposure dose. | ||
** You can find a list of mask aligners <u>[[Specific_Process_Knowledge/Lithography/UVExposure|here]]</u>. | ** You can find a list of mask aligners <u>[[Specific_Process_Knowledge/Lithography/UVExposure|here]]</u>. | ||
** You can find information on dose <u>[[Specific_Process_Knowledge/Lithography/UVExposure_Dose|here]]</u>. | ** You can find information on dose <u>[[Specific_Process_Knowledge/Lithography/UVExposure_Dose|here]]</u>. | ||