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| == Flip-chip bonder (glue attachment) ==
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| [[image:Flip_chip_Bonder_dr_Tresky.jpg|200x200px|right|thumb|The Flip chip bonder is placed in the Packlab in building 347, 1. floor.]]
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| The flip chip bonder can be used to place chips on a substrate with high precision. This way electrical contacts can be made between contact pads on the chip and substrate.
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| With a dispensing tool small amounts of solder paste or glue is dispensed on the substrate with high accuracy. The substrate could for example be a printed circuit board (PCB). After some experience with the machine, it is possible to place dots with different shapes and sizes on the surface. With a placement tool a chip can then be picked up upside down and by the use of a camera unit, it is possible to align the contacts on the chip to the solder/glue dots on the on the substrate before joining the two surfaces with a light pressure. The stack is subsequently cured and an underfill glue can be dispensed to enhance the bonding strength between chip and substrate.
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| The Flip Chip Bonder is placed in Nanolab Packlab building 347, 1. floor.
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| '''The user manuals, user APVs, technical information and contact information can be found in LabManager:'''
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| <!-- give the link to the equipment info page in LabManager: -->
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| [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=319 Flip-chip Bonder in LabManager]
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| ==Equipment performance and process related parameters== | | ==Equipment performance and process related parameters== |
