Specific Process Knowledge/Etch/Etching of Bulk Glass: Difference between revisions
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*~75 nm/min (Thermal oxide) in BHF | *~75 nm/min (Thermal oxide) in BHF | ||
*~ | *~80 nm/min (Thermal oxide) in BOE 7:1 Etchant VLSI with Surfactant | ||
*~25 nm/min (Thermal oxide) in 5%HF | *~25 nm/min (Thermal oxide) in 5%HF | ||
*~3-4µm/min in 40%HF | *~3-4µm/min in 40%HF | ||