Specific Process Knowledge/Characterization/Sample imaging: Difference between revisions
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[[Specific_Process_Knowledge/Characterization/SEM_Supra_2| SEM Supra 2]], | [[Specific_Process_Knowledge/Characterization/SEM_Supra_2| SEM Supra 2]], | ||
[[Specific_Process_Knowledge/Characterization/SEM_Supra_3| SEM Supra 3]], | [[Specific_Process_Knowledge/Characterization/SEM_Supra_3| SEM Supra 3]], | ||
[[Specific_Process_Knowledge/Characterization/SEM_Tabletop_1| SEM Tabletop 1]]) | [[Specific_Process_Knowledge/Characterization/SEM_Tabletop_1| SEM Tabletop 1]]) | ||
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|Light | |Light | ||
| | | | ||
Detection of | |||
*Secondary electrons | *Secondary electrons | ||
*Backscattered electrons | *Backscattered electrons | ||
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*Film thickness | *Film thickness | ||
| | | | ||
*Structure dimensions | |||
*Surface topography | |||
*Material composition | |||
|3D surface topography | |3D surface topography | ||
|3D surface topography (if you make a map scan) | |3D surface topography (if you make a map scan) | ||
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*PSI: 0.01 nm | *PSI: 0.01 nm | ||
*VSI: 1 nm | *VSI: 1 nm | ||
|1- | |1-100 nm (lowest resolution for the SEM Tabletop 1) | ||
Depends on what SEM you use | Depends on what SEM you use | ||
|< 1Å | |< 1Å | ||
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*10x objective: 4.95 μm | *10x objective: 4.95 μm | ||
*100x objective: 0.495 μm | *100x objective: 0.495 μm | ||
|1- | |1-100 nm | ||
Depends on what SEM you use | Depends on what SEM you use | ||
|Down to 1.4 nm | |Down to 1.4 nm | ||
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|Samples have to be (semi)conducting, but may have a thin (> ~ 5 µm) layers of non-conducting materials on top. | |Samples have to be (semi)conducting, but may have a thin (> ~ 5 µm) layers of non-conducting materials on top. | ||
Non-conducting samples can be studied using VP (variable pressure) mode in the SEM Suora 1, 2 and 3 | |||
|Sample dimensions have to be smaller than stylus dimensions | |Sample dimensions have to be smaller than stylus dimensions | ||
|Sample dimensions have to be smaller than tip dimensions | |Sample dimensions have to be smaller than tip dimensions | ||
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*One 100 mm wafer | *One 100 mm wafer | ||
*One 150 mm wafer | *One 150 mm wafer | ||
*One | :(not possible to inspect entire wafer in SEM Supra 1 and 3) | ||
:(only Supra 2, not possible to inspect entire wafer) | *One 200 mm wafer | ||
:(only SEM Supra 2, not possible to inspect entire wafer) | |||
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*One small sample | *One small sample | ||
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*All sample materials, expect: | *All sample materials, expect: | ||
Samples that may disintegrate, produce dust/particles or degas (e.g. wet polymers and powders. Samples with resist or polymer should be properly baked and outgassed before SEM inspection | :Samples that may disintegrate, produce dust/particles or degas (e.g. wet polymers and powders). Samples with resist or polymer should be properly baked and outgassed before SEM inspection | ||
| | | | ||
*All standard cleanroom materials, except samples that might damage or stick to the tip. | *All standard cleanroom materials, except samples that might damage or stick to the tip. | ||