Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride: Difference between revisions
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==Deposition of Silicon Nitride using LPCVD== | ==Deposition of Silicon Nitride using LPCVD== | ||
DTU Nanolab has two LPCVD (Low Pressure Chemical Vapour Deposition) furnaces <!--[[Specific Process Knowledge/Thin film deposition/B2 Furnace LPCVD Nitride|LPCVD furnaces]]--> for deposition of silicon nitride: | |||
*A 4" furnace (installed in 1995) for deposition og stoichiometric nitride on 4 inch wafers. | *A 4" furnace (installed in 1995) for deposition og stoichiometric nitride on 4 inch wafers. | ||
*A 6" furnace (installed in 2008) for deposition of low stress/silicon rich nitride on 4 inch and 6 inch wafers. Deposition of stoichiometric nitride on 4 inch wafers is also allowed in this furnace. | *A 6" furnace (installed in 2008) for deposition of low stress/silicon rich nitride on 4 inch and 6 inch wafers. Deposition of stoichiometric nitride on 4 inch wafers is also allowed in this furnace. | ||