Specific Process Knowledge/Bonding: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Bonding click here]''' | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Bonding click here]''' | ||
For bonding samples to a carrier wafer in order to enable dry etching, please go [[Specific_Process_Knowledge/Etch/DryEtchProcessing/Bonding|'''here''']]. | |||
For bonding samples to a carrier wafer for UV-lithography using automatic coater and developer, please see this process flow: [[media:Process_Flow_ChipOnCarrier.docx|Process_Flow_ChipOnCarrier.docx]] | |||
== Choose equipment == | == Choose equipment == | ||