Specific Process Knowledge/Etch/DryEtchProcessing/Bonding: Difference between revisions
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=== Purpose === | === Purpose === | ||
The dry etch tools are set up for processing one particular size of wafer. The reasons why a tool processes one size of wafers and not others are numerous - they may include: | |||
* Hardware availability | * Hardware availability | ||
* Processes required by users | * Processes required by users | ||
The dry etch tools at Nanolab all have a default wafer size and may have other sizes of electrodes available. Other sizes of wafers or chips may also be processed but they will | The dry etch tools at Nanolab all have a default wafer size and may have other sizes of electrodes available. Other sizes of wafers or chips may also be processed but they will require the use of a carrier wafer. Using a carrier is also often required if the side of the wafer facing the electrode has structures. | ||
{| border="2" cellpadding="2" cellspacing="1" style="text-align:center;" | {| border="2" cellpadding="2" cellspacing="1" style="text-align:center;" | ||
|+ ''' | |+ '''Processing different sizes of wafers or chips in the dry etch tools at Nanolab ''' | ||
|- | |- | ||
! Tool | ! Tool | ||