Specific Process Knowledge/Wafer cleaning: Difference between revisions
| Line 58: | Line 58: | ||
Make the surface hydrophillic | Make the surface hydrophillic | ||
|Removing dust and particles | |Removing dust and particles | ||
| | |Removing slurry residues from the CMP | ||
|- | |- | ||
| Line 69: | Line 69: | ||
|Recommended cleaning and treatment before wafer bonding | |Recommended cleaning and treatment before wafer bonding | ||
|Mandatory cleaning of very dirty items that enters the cleanroom. Should always be followed by a piranha clean. | |Mandatory cleaning of very dirty items that enters the cleanroom. Should always be followed by a piranha clean. | ||
| | |Recommended cleaning after CMP | ||
|- | |- | ||
| Line 85: | Line 85: | ||
*<nowiki>#</nowiki>1-25 2" and 4" wafers | *<nowiki>#</nowiki>1-25 2" and 4" wafers | ||
| | | | ||
*All sizes that can go into the bath| | *All sizes that can go into the bath | ||
| | |||
*<nowiki>#</nowiki>1 20x20mm sample as well as 2", 4" and 6inch wafers | |||
|- | |- | ||
| Line 126: | Line 128: | ||
*All materials | *All materials | ||
| | | | ||
*Silicon | |||
*Poly Silicon | |||
*Silicon Oxide | |||
*Quartz/fused silica | |||
|- | |- | ||
|} | |} | ||