Specific Process Knowledge/Lithography/Coaters: Difference between revisions
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After spin coating, the solvent in the resist formulation must be evaporated in a baking step in order to solidify the resist. This softbake can be carried out as a contact bake or a proximity bake. In a contact bake, the wafer is held in close contact to the hotplate surface while resting on shallow bumps only 150µm above the hotplate. In a proximity bake, the wafer is first moved into proximity, e.g. 1mm, of the hotplate surface, then held there (on the lift pins) for the duration of the bake. | After spin coating, the solvent in the resist formulation must be evaporated in a baking step in order to solidify the resist. This softbake can be carried out as a contact bake or a proximity bake. In a contact bake, the wafer is held in close contact to the hotplate surface while resting on shallow bumps only 150µm above the hotplate. In a proximity bake, the wafer is first moved into proximity, e.g. 1mm, of the hotplate surface, then held there (on the lift pins) for the duration of the bake. | ||
=Spin coaters at | =Spin coaters at DTU Nanolab= | ||
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[[image:SpinCoaterGammaUV.jpg|400px|right|thumb|Spin Coater: Gamma UV in E-5]] | [[image:SpinCoaterGammaUV.jpg|400px|right|thumb|Spin Coater: Gamma UV in E-5]] | ||
'''Feedback to this section''': '''[mailto:labadviser@ | '''Feedback to this section''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV click here]''' | ||
''[[Specific_Process_Knowledge/Lithography/Coaters#Coater_Comparison_Table|Coater comparison table]]'' | ''[[Specific_Process_Knowledge/Lithography/Coaters#Coater_Comparison_Table|Coater comparison table]]'' | ||
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'''[http://podcast.llab.dtu.dk/fileadmin/podcasts/2016/DTUDanchip/1.055_Spin_Coater_GAMMA_UV-720p.mp4 Training video]''' | '''[http://podcast.llab.dtu.dk/fileadmin/podcasts/2016/DTUDanchip/1.055_Spin_Coater_GAMMA_UV-720p.mp4 Training video]''' | ||
'''The user manual, user APV, and contact information can be found in [http://labmanager | '''The user manual, user APV, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=359 LabManager]''' | ||
===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma UV processing|Process information]]=== | ===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma UV processing|Process information]]=== | ||
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==Spin Coater: Gamma E-beam and UV== | ==Spin Coater: Gamma E-beam and UV== | ||
'''Feedback to this section''': '''[mailto:labadviser@ | '''Feedback to this section''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_E-beam_and_UV click here]''' | ||
''[[Specific_Process_Knowledge/Lithography/Coaters#Coater_Comparison_Table|Coater comparison table]]'' | ''[[Specific_Process_Knowledge/Lithography/Coaters#Coater_Comparison_Table|Coater comparison table]]'' | ||
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'''[http://podcast.llab.dtu.dk/fileadmin/podcasts/2016/DTUDanchip/1.055_Spin_Coater_GAMMA_UV-720p.mp4 Training video]''' | '''[http://podcast.llab.dtu.dk/fileadmin/podcasts/2016/DTUDanchip/1.055_Spin_Coater_GAMMA_UV-720p.mp4 Training video]''' | ||
'''The user manual, user APV, and contact information can be found in [http://labmanager | '''The user manual, user APV, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=417 LabManager]''' | ||
===Process information=== | ===Process information=== | ||
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[[Image:Spinner_RCD8_C-1.jpg|400px|thumb|Spin coater: RCD8 is located in C-1]] | [[Image:Spinner_RCD8_C-1.jpg|400px|thumb|Spin coater: RCD8 is located in C-1]] | ||
'''Feedback to this section''': '''[mailto:labadviser@ | '''Feedback to this section''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_RCD8 click here]''' | ||
''[[Specific_Process_Knowledge/Lithography/Coaters#Coater_Comparison_Table|Coater comparison table]]'' | ''[[Specific_Process_Knowledge/Lithography/Coaters#Coater_Comparison_Table|Coater comparison table]]'' | ||
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Spin Coater: RCD8 is a model RCD8 T spin coater from Süss MicroTec with a motorized media arm and Gyrset functionality. It's primary purpose is spin coating of SU-8 resist. However, due to the possibility of using a non-vacuum chuck, the spin coater is also suitable for coating of substrates with e.g. textured backsides or membranes. | Spin Coater: RCD8 is a model RCD8 T spin coater from Süss MicroTec with a motorized media arm and Gyrset functionality. It's primary purpose is spin coating of SU-8 resist. However, due to the possibility of using a non-vacuum chuck, the spin coater is also suitable for coating of substrates with e.g. textured backsides or membranes. | ||
'''The user manual, user APV, and contact information can be found in [http://labmanager | '''The user manual, user APV, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=360 LabManager]''' | ||
===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing|Process information]]=== | ===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing|Process information]]=== | ||
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| '''[http://labmanager | | '''[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=362 LabManager]''' || '''[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=387 LabManager]''' || '''[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=315 LabManager]''' | ||
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