Jump to content

Specific Process Knowledge/Thermal Process/Oxidation/Standard oxidation recipes: Difference between revisions

Pevo (talk | contribs)
Pevo (talk | contribs)
Line 66: Line 66:
If a recipe is aborted, it will jump to the STANDBY step.  
If a recipe is aborted, it will jump to the STANDBY step.  


The furnace is kept closed and clean:
The furnace is closed and kept clean by an N<sub>2</sub> flow:


* Standby temperature: 700 <sup>o</sup>C
* Standby temperature: 700 <sup>o</sup>C
Line 77: Line 77:
'''01 LM-LOCK'''
'''01 LM-LOCK'''


''Message: "Standby"''
The recipe can only continue, if a user is logged on in LabManager, otherwise the furnace will shown an alarm (digital input 6) after 1 minute.
 
The recipe can only continue, if a user is logged on in LabManager




Line 95: Line 93:
When the furnace is open, the user can load wafers in the furnace.  
When the furnace is open, the user can load wafers in the furnace.  


The user has to press "Start" (on the touch screen) or "Continue" (on the furnace computer) to close the furnace.   
The quartz boat for the wafers is located in furnace, so it has to be liftet down on the quartz plate, before the wafers are loaded.
 
After the wafers are loaded, the user has to press "Start" (on the touch screen) or "Continue" (on the furnace computer) to close the furnace.   




Line 102: Line 102:
''Message: "Boat moving"''
''Message: "Boat moving"''


The furnace is closing.
The furnace closes.  




Line 109: Line 109:
''Message: "Heat-up"''
''Message: "Heat-up"''


The furnace is heating up to the temperature defined in the recipe (usually 800-1150 <sup>o</sup>C.
The furnace heats up to the temperature defined in the recipe (usually 800-1150 <sup>o</sup>C).


The recipe will continue to the next step, when the temperature of center heating zone (zone 2) reaches the right temperature.  
The recipe will continue to the next step, when the temperature of center heating zone (zone 2) reaches the right temperature.  
Line 116: Line 116:
'''06 OXIDATION'''
'''06 OXIDATION'''


''Message: "Dry oxidation"''
''Message: "Oxidation"''
 
The dry oxidation is started by flowing O<sub>2</sub through the furnace instead of N<sub>2</sub.


The dry oxidation is started
O<sub>2</sub> flow: 5 SLM
O<sub>2</sub> flow: 5 SLM
N<sub>2</sub> flow: 0 SLM
N<sub>2</sub> flow: 0 SLM


The oxidation time is a variable command.  
The oxidation time is a variable command, so it can be set by the user.


has been defined by the user. The oxidation time can be changed, until the oxidation step is started.  
The oxidation time can be changed, until the oxidation step is started.  




Line 130: Line 131:


''Message: "Anneals/Dens"''
''Message: "Anneals/Dens"''
The O<sub>2</sub> gas is purged out of the furnace by an N<sub>2</sub> flow, so that the oxidation stop.
The wafers are annealed in N<sub>2</sub> at the same temperature as the oxidation temperature. The annealing will improve the oxide quality by making it more dense.
N<sub>2</sub> flow: 6 SLM
O<sub>2</sub> flow: 0 SLM
Normally the annealing time is 20 minutes, but it is a variable command, so it can be set by the user.