Specific Process Knowledge/Thermal Process/Oxidation/Standard oxidation recipes: Difference between revisions
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If a recipe is aborted, it will jump to the STANDBY step. | If a recipe is aborted, it will jump to the STANDBY step. | ||
The furnace is | The furnace is closed and kept clean by an N<sub>2</sub> flow: | ||
* Standby temperature: 700 <sup>o</sup>C | * Standby temperature: 700 <sup>o</sup>C | ||
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'''01 LM-LOCK''' | '''01 LM-LOCK''' | ||
The recipe can only continue, if a user is logged on in LabManager, otherwise the furnace will shown an alarm (digital input 6) after 1 minute. | |||
The recipe can only continue, if a user is logged on in LabManager | |||
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When the furnace is open, the user can load wafers in the furnace. | When the furnace is open, the user can load wafers in the furnace. | ||
The user has to press "Start" (on the touch screen) or "Continue" (on the furnace computer) to close the furnace. | The quartz boat for the wafers is located in furnace, so it has to be liftet down on the quartz plate, before the wafers are loaded. | ||
After the wafers are loaded, the user has to press "Start" (on the touch screen) or "Continue" (on the furnace computer) to close the furnace. | |||
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''Message: "Boat moving"'' | ''Message: "Boat moving"'' | ||
The furnace | The furnace closes. | ||
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''Message: "Heat-up"'' | ''Message: "Heat-up"'' | ||
The furnace | The furnace heats up to the temperature defined in the recipe (usually 800-1150 <sup>o</sup>C). | ||
The recipe will continue to the next step, when the temperature of center heating zone (zone 2) reaches the right temperature. | The recipe will continue to the next step, when the temperature of center heating zone (zone 2) reaches the right temperature. | ||
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'''06 OXIDATION''' | '''06 OXIDATION''' | ||
''Message: " | ''Message: "Oxidation"'' | ||
The dry oxidation is started by flowing O<sub>2</sub through the furnace instead of N<sub>2</sub. | |||
O<sub>2</sub> flow: 5 SLM | O<sub>2</sub> flow: 5 SLM | ||
N<sub>2</sub> flow: 0 SLM | N<sub>2</sub> flow: 0 SLM | ||
The oxidation time is a variable command. | The oxidation time is a variable command, so it can be set by the user. | ||
The oxidation time can be changed, until the oxidation step is started. | |||
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''Message: "Anneals/Dens"'' | ''Message: "Anneals/Dens"'' | ||
The O<sub>2</sub> gas is purged out of the furnace by an N<sub>2</sub> flow, so that the oxidation stop. | |||
The wafers are annealed in N<sub>2</sub> at the same temperature as the oxidation temperature. The annealing will improve the oxide quality by making it more dense. | |||
N<sub>2</sub> flow: 6 SLM | |||
O<sub>2</sub> flow: 0 SLM | |||
Normally the annealing time is 20 minutes, but it is a variable command, so it can be set by the user. | |||