Specific Process Knowledge/Etch: Difference between revisions
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*[[/ASE (Advanced Silicon Etch)|ASE (Advanced Silicon Etch)]] | *[[/ASE (Advanced Silicon Etch)|ASE (Advanced Silicon Etch)]] | ||
*[[/AOE (Advanced Oxide Etch)|AOE (Advanced Oxide Etch)]] | *[[/AOE (Advanced Oxide Etch)|AOE (Advanced Oxide Etch)]] | ||
*[[/DRIE-Pegasus| DRIE-Pegasus 1 and | *[[/DRIE-Pegasus| DRIE-Pegasus 1, 2 and 3 (Silicon Etch), and 4 (converted to dielectrics etch)]] | ||
*[[/ICP Metal Etcher|ICP Metal Etch]] | *[[/ICP Metal Etcher|ICP Metal Etch]] | ||
*[[/III-V ICP|III-V ICP]] | *[[/III-V ICP|III-V ICP]] | ||