Specific Process Knowledge/Etch/Etching of Silicon Oxide: Difference between revisions
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![[Specific Process Knowledge/Etch/ICP Metal Etcher|ICP metal]] | ![[Specific Process Knowledge/Etch/ICP Metal Etcher|ICP metal]] | ||
![[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE/IBSD Ionfab 300]] | ![[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE/IBSD Ionfab 300]] | ||
![[Specific Process Knowledge/Etch/HF Vapour Phase Etch|HF Vapour Phase Etch]] | |||
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*Primarily for pure physical etch by sputtering with Ar-ions | *Primarily for pure physical etch by sputtering with Ar-ions | ||
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*This is a fact about HF VPE | |||
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*Any material that is accepted in the machine | *Any material that is accepted in the machine | ||
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*HF VPE mask material 1 | |||
*HF VPE mask material 2 | |||
*HF VPE mask material 3 | |||
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*Process dependent | *Process dependent | ||
*Tested once ~22nm/min | *Tested once ~22nm/min | ||
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*Sample and load dependent | |||
*Expected range: 12 - 175 nm/min | |||
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*<nowiki>#</nowiki>1 150 mm wafers with special carrier | *<nowiki>#</nowiki>1 150 mm wafers with special carrier | ||
*<nowiki>#</nowiki>1 200 mm wafer | *<nowiki>#</nowiki>1 200 mm wafer | ||
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*Pieces | |||
*<nowiki>#</nowiki>1 50 mm wafer | |||
*<nowiki>#</nowiki>1 100 mm wafer | |||
*<nowiki>#</nowiki>1 150 mm wafer | |||
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*Polymers | *Polymers | ||
*Capton tape | *Capton tape | ||
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*[http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=458 Please take a look in the cross contamination sheet in LabManager for details] | |||
*Silicon | |||
*Silicon oxides | |||
*Aluminium | |||
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