Specific Process Knowledge/Etch/ICP Metal Etcher/silicon/isotropic: Difference between revisions
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! no name, tested by Lior Shiv@Capres 2019- | ! no name, tested by Lior Shiv@Capres 2019-07-12 <!--Recipe Name --> | ||
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| 20 <!--Temperature --> | | 20 <!--Temperature --> |
Revision as of 09:41, 13 August 2019
Isotropic etching in silicon on the ICP Metal Etch
Recipe | Step | Temp. | Time | Pres. | Hardware | Gasses | RF powers | Observations | |||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
SF6 | O2 | C4F8 | Ar | CF4 | H2 | CH4 | BCl3 | Cl2 | HBr | Coil | Platen | SEM images of different runs | Keywords | ||||||
isoslow1 | A | 20 | - | 10 | - | 90 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 400 | 3 | Click HERE! | Note: Lior Shiv got very high etch rate for this recipe >1.5µm/min 2019-07-12 |
no name, tested by Lior Shiv@Capres 2019-07-12 | A | 20 | - | 10 | - | 90 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 150 | 3 | About 10% load, etch rate around 400nm/min |