Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions
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The dicer feature versatile processing capabilities, compact designs, and high precision and reliability. Users perform workpiece loading, alignment, and unloading manually. | The dicer feature versatile processing capabilities, compact designs, and high precision and reliability. Users perform workpiece loading, alignment, and unloading manually. | ||
The dicer at DTU Nanolab is placed in room 157 on the first floor in bldg. 346. Please notice that this is not a cleanroom and that the dicing process is very dirty | The dicer at DTU Nanolab is placed in room 157 on the first floor in bldg. 346. Please notice that this is not a cleanroom and that the dicing process is very dirty. | ||
In general it is ''not allowed'' to bring back your samples into the Cleanroom. You need approval from DTU Nanolab staff to do this. Your samples have to be thoroughly cleaned in the gowning area and get a Piranha cleaning. You will only be allowed to use a limited number of tools for the processing after dicing. | |||
Please consider your layout of dies on your wafer. The dicer can only cut straight lines across the wafer and you can not end a line in the middle of the wafer. | |||
Please see the illustrations for a good and a bad design. | |||
[[Image:Disco_DAD_321_Dicer.jpg|300x300px|Good design]] | |||
[[Image:Disco_DAD_321_Dicer.jpg|300x300px|Bad design]] | |||
'''The user manual, user APV, technical information and contact information can be found in LabManager:''' | '''The user manual, user APV, technical information and contact information can be found in LabManager:''' | ||