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Specific Process Knowledge/Pattern Design: Difference between revisions

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Kabi (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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* For '''UV-lithography''' it is necessary to have a physical mask produced based on a layout file. The file format has to be CIF or GDS. For more details see below [[Specific_Process_Knowledge/Pattern_Design#Mask Fabrication for UV-lithography|Mask Fabrication for UV-lithography]].
* For '''UV-lithography''' it is necessary to have a physical mask produced based on a layout file. The file format has to be CIF or GDS. For more details see below [[Specific_Process_Knowledge/Pattern_Design#Mask Fabrication for UV-lithography|Mask Fabrication for UV-lithography]].


* For '''DUV-lithography''' and DUV-lithography it is necescary to have physical masks (reticles) produced based on the layout file. The file format has to be GDS. For more details concerning the design of reticles see [[Specific_Process_Knowledge/Lithography/DUVStepperLithography#Process_information|Design of Reticles]].
* For '''DUV-lithography''' and DUV-lithography it is necessary to have physical masks (reticles) produced based on the layout file. The file format has to be GDS. For more details concerning the design of reticles see [[Specific_Process_Knowledge/Lithography/DUVStepperLithography#Process_information|Design of Reticles]].


== Mask Fabrication for UV-lithography ==
== Mask Fabrication for UV-lithography ==
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