Specific Process Knowledge/Etch/ICP Metal Etcher/silicon nitride: Difference between revisions

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===Slow etch of silicon nitride with resist as masking material - on 6" carrier wafer with recess ===
===Slow etch of silicon nitride with resist as masking material - on 6" carrier wafer with recess ===
This recipe can be used for slow etching of silicon nitride with resist as masking material. Here are some test results presented. The same recipe is being used for SiO2, see the result for that here: [Specific Process Knowledge/Etch/ICP Metal Etcher/silicon oxide/
This recipe can be used for slow etching of silicon nitride with resist as masking material. Here are some test results presented. The same recipe is being used for SiO2, see the result for that [[Specific Process Knowledge/Etch/ICP Metal Etcher/silicon oxide#Slow etch of SiO2 with resist as masking material-using a 6.22 carrier wafer with recess|here]]


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Revision as of 07:07, 26 June 2019

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Slow etch of silicon nitride with resist as masking material - on 6" carrier wafer with recess

This recipe can be used for slow etching of silicon nitride with resist as masking material. Here are some test results presented. The same recipe is being used for SiO2, see the result for that here


Parameter A slow etch with carrier
Coil Power [W] 200
Platen Power [W] 25
Platen temperature [oC] 0
CF4 flow [sccm] 20
H2 flow [sccm] 10
Pressure [mTorr] 3


Results Test on wafer with 20% load, by Izzet Yildiz @Nanotech Test by BGHE @danchip
Etch rate of LPCVD nitride 60-65 nm/min (20% etch load) (Feb. 2014)  
Selectivity to resist [SiN : AZ resist] 1:0.75  
Wafer uniformity (100mm) ?  
Profile [o] ?  
Wafer uniformity map (click on the image to view a larger image) not measured  
SEM profile images Not measured  
Etch rate in Barc   ~50 nm/min (Date: 2014-09-09)
Etch rate in KRF resist   ~40 nm/min (Date: 2014-09-09)