Specific Process Knowledge/Etch/DRIE-Pegasus/DUVetch: Difference between revisions
| Line 273: | Line 273: | ||
| rowspan="2" | [[Specific Process Knowledge/Etch/DRIE-Pegasus/Parameters#Hardware | HW]] | | rowspan="2" | [[Specific Process Knowledge/Etch/DRIE-Pegasus/Parameters#Hardware | HW]] | ||
! width="40" rowspan="2" | Runs | ! width="40" rowspan="2" | Runs | ||
! width="300" | Key words | ! width="300" rowspan="2" | Key words | ||
|- | |- | ||
| degs | | degs | ||
Revision as of 14:26, 25 June 2019
Feedback to this page: click here
Etch processes designed for stepper resists
The stepper produces features down to 200 nm. Here, etch processes especially designed for stepper patterns and resists are described. We intend to develop them continuously so keep an eye on this page. The best ones so far are:
| Recipe | Step | Temp. | Deposition step | Etch step | Process | ||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Time | Pressure | C4F8 | SF6 | O2 | Coil | Time | Pressure | C4F8 | SF6 | O2 | Coil | Platen | HW | Runs | Keywords | ||||||||||
| B | M | B | M | B | M | B | M | B | M | B | M | B | M | ||||||||||||
| NBoost04 | A | 20 | 2.8 | 5 | 60 | 0 | 0 | 500 | 1.5 | 3.5 | 30% | 5 | 0 | 20 | 100 | 100 | 0 | 0 | 500 | 500 | 50 | 10 | LF+B100 | 2 | VERY nice: scallops, straight sidewalls |
| Recipe | Step | Temp. | Deposition step | Etch step | Process observations | |||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Time | Pressure | C4F8 | SF6 | O2 | Coil | Time | Pressure | C4F8 | SF6 | O2 | Coil | Platen | HW | Runs | Key words | |||
| polySOI-10 | etch | 20 | 2.5 | 10 | 50 | 0 | 0 | 600 | 5 | 10 | 20 | 60 | 5 | 400 | 40 | - | 5 | very nice, blurred scallops |
| polySOI-10a | etch | 20 | 2.5 | 10 | 50 | 0 | 0 | 600 | 5 | 10 | 10 | 70 | 5 | 400 | 40 | - | 200+ | Works only with limited open area - probably less than 20 %, very stable, excellent and extensive track record |
With units
| Recipe | Step | Temp. | Deposition step | Etch step | Process | ||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Time | Pressure | C4F8 | SF6 | O2 | Coil | Time | Pressure | C4F8 | SF6 | O2 | Coil | Platen | HW | Runs | Keywords | ||||||||||
| B | M | B | M | B | M | B | M | B | M | B | M | B | M | ||||||||||||
| degs | s | mt | sccm | sccm | sccm | W | s | s | % | mt | sccm | sccm | sccm | sccm | sccm | sccm | W | W | W | W | |||||
| NBoost04 | A | 20 | 2.8 | 5 | 60 | 0 | 0 | 500 | 1.5 | 3.5 | 30% | 5 | 0 | 20 | 100 | 100 | 0 | 0 | 500 | 500 | 50 | 10 | LF+B100 | 2 | VERY nice: scallops, straight sidewalls |
| Recipe | Step | Temp. | Deposition step | Etch step | Process observations | |||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Time | Pressure | C4F8 | SF6 | O2 | Coil | Time | Pressure | C4F8 | SF6 | O2 | Coil | Platen | HW | Runs | Key words | |||
| degs | s | mt | sccm | sccm | sccm | W | s | mt | sccm | sccm | sccm | W | W | |||||
| polySOI-10 | etch | 20 | 2.5 | 10 | 50 | 0 | 0 | 600 | 5 | 10 | 20 | 60 | 5 | 400 | 40 | - | 5 | very nice, blurred scallops |
| polySOI-10a | etch | 20 | 2.5 | 10 | 50 | 0 | 0 | 600 | 5 | 10 | 10 | 70 | 5 | 400 | 40 | - | 200+ | Works only with limited open area - probably less than 20 %, very stable, excellent and extensive track record |