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Specific Process Knowledge/Thin film deposition/Deposition of Nickel: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, danchip
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Choi (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, danchip
641 edits
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|Sample must be compatible with plating bath. Seed metal necessary.
|Sample must be compatible with plating bath (pH = 3,65 and T = 52°C). Seed metal necessary.
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