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Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 02 processing: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
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Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,526 edits
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|-
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!rowspan="2"|AZ 5206E
!AZ 5206E
|rowspan="2"|1.5 µm
|0.5 µm
| 375nm
| 375 nm
| 60 mJ/cm<sup>2</sup>
| Fast: 60 mJ/cm<sup>2</sup> <br> Quality: 60 mJ/cm<sup>2</sup>
| -6
| Fast: -6 <br> Quality: -6
| comment
| Fast: 1 µm (not optimized) <br> Quality: ~750 nm (not optimized)
|-style="background:WhiteSmoke; color:black"
| Dev: 2xSP30s
| 405nm
| 60 mJ/cm<sup>2</sup>
| -6
| comment
|-
|-


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|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
!rowspan="2"|AZ 5214E
!rowspan="2"|AZ 5214E
|1.5 µm
|rowspan="2"|1.5 µm
|22? mJ/cm<sup>2</sup>
| 405 nm
|Single puddle, 60 s
| Fast: 90 mJ/cm<sup>2</sup>
|rowspan="2"|Image reversal process.
| Fast: -2
 
| Fast: 1-2 µm
Reversal bake: 120s at 110°C.<br>Flood exposure after reversal bake: 195 mJ/cm<sup>2</sup>
| Dev: SP60s
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
|2.2 µm
| 375 nm
|25 mJ/cm<sup>2</sup>
| Fast: 65 mJ/cm<sup>2</sup> <br> Quality: 65 mJ/cm<sup>2</sup>
|Single puddle, 60 s
| Fast: 2 <br> Quality: 2
| Fast: ~1 µm <br> Quality: ~750 nm
| Dev: SP60s
|-
|-


|-
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!AZ 4562
!rowspan="2"|AZ MiR 701
|10 µm
|rowspan="2"|1.5 µm
|520-?? mJ/cm<sup>2</sup>
| 405 nm
|Multiple puddle, 4 x 60 s
| Fast: 200 mJ/cm<sup>2</sup>
|Multiple exposure with 10 s pauses is recommended.
| Fast: -5
 
| Fast: ~1 µm (not optimized)
Process not yet established.
| PEB: 60s@110°C, Dev: SP60s
|-style="background:WhiteSmoke; color:black"
| 375 nm
| Fast: 170 mJ/cm<sup>2</sup> <br> Quality: 180 mJ/cm<sup>2</sup>
| Fast: -5 <br> Quality: -6
| Fast: 1 µm <br> Quality: <750 nm
| PEB: 60s@110°C, Dev: SP60s
|-
|-


|-
|-
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
!rowspan="3"|AZ MiR 701
! AZ nLOF 2020
|1.5 µm
| 2 µm
|169 mJ/cm<sup>2</sup>
| 375 nm
|Single puddle, 60 s
| Fast: 400 mJ/cm<sup>2</sup> <br> Quality: 400 mJ/cm<sup>2</sup>
|rowspan="2"|PEB: 60 s at 110°C
| Fast: 5 <br> Quality: 0
|-style="background:LightGrey; color:black"
| Fast: ~1 µm (not optimized) <br> Quality: 1 µm
|2 µm
| Dev: SP60s
|~200 mJ/cm<sup>2</sup>
|Single puddle, 60 s
|-style="background:LightGrey; color:black"
|4 µm
|~280 mJ/cm<sup>2</sup>
|Single puddle, 60 s
|rowspan="1"|PEB: 60 s at 110°C
 
Process adopted from process logs.
|-
|-


|-
|-style="background:WhiteSmoke; color:black"
!AZ nLOF 2020
|1.5 µm
|104 mJ/cm<sup>2</sup>
|Single puddle, 30 s
|PEB: 60 s at 110°C
Use 60 s development for lift-off
|-
|}
|}
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