Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 02 processing: Difference between revisions
| Line 204: | Line 204: | ||
'''Result of using only the alignment tool, pushing it to the extremes:''' | '''Result of using only the alignment tool, pushing it to the extremes:''' | ||
-11.08 to 5.54mRad, corresponding to -0.6 to 0.3°, average -0.1±0.5° (6 measurements, including 2 without pushing the alignment tool). Measured using pneumatic autofocus. | -11.08 to 5.54mRad, corresponding to -0.6 to 0.3°, average -0.1±0.5° (6 measurements, including 2 without pushing the alignment tool). Measured using pneumatic autofocus. This is comparable to the ±1° flat-to-crystal alignment spec of the SEMI wafer standard. | ||
It would seem that applying the flat angle measured with optical autofocus to the print introduces more error than relying only on the alignment tool. | It would seem that applying the flat angle measured with optical autofocus to the print introduces more error than relying only on the alignment tool. | ||