Jump to content

Specific Process Knowledge/Etch/DRIE-Pegasus/Etch silicon nanostructures: Difference between revisions

Bincha (talk | contribs)
No edit summary
Bincha (talk | contribs)
No edit summary
Line 25: Line 25:
|}
|}


Extra caution is required for modification of recipe parameters, it is recommended to monitor the picoscope signals during the process, the process should be aborted if a high reflective power is observed either from coil or platen generators, thus hardware damage can be avoied. For more details, please contact Henri Jansen (henrija@dtu.dk) or Bingdong Chang (bincha@dtu.dk)
Extra caution is required for modification of recipe parameters, it is recommended to monitor the picoscope signals during the process, the process should be aborted manually if a high reflective power is observed either from coil or platen generators, thus hardware damage can be avoied. For more details, please contact Henri Jansen (henrija@dtu.dk) or Bingdong Chang (bincha@dtu.dk)