Specific Process Knowledge/Characterization/Stress measurement: Difference between revisions
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==When the deposition is on one side of the wafer== | ==When the deposition is on one side of the wafer== | ||
#Make a pre-measurement. Measure the wafer bow on one of the stylus profilometers ([[Specific Process Knowledge/Characterization/Profiler#Dektak XTA_new stylus profiler|Dektak XTA_new]] or [[Specific Process Knowledge/Characterization/Profiler#Dektak _8 stylus _profiler|Dektak 8]]). Save the measurement. It is a good idea to measure across most of the wafer (at least along 70% of the wafer diameter) in two directions perpendicular to each other. | #Make a pre-stress measurement. Measure the wafer bow on one of the stylus profilometers ([[Specific Process Knowledge/Characterization/Profiler#Dektak XTA_new stylus profiler|Dektak XTA_new]] or [[Specific Process Knowledge/Characterization/Profiler#Dektak _8 stylus _profiler|Dektak 8]]). Save the measurement. It is a good idea to measure across most of the wafer (at least along 70% of the wafer diameter) in two directions perpendicular to each other. | ||
#Measure the thickness of the wafer | #Measure the thickness of the wafer | ||
#Deposit the thin film | #Deposit the thin film | ||
#Measure the thickness of the thin film (ex. using the FilmTek or the Ellipsometer). | #Measure the thickness of the thin film (ex. using the FilmTek or the Ellipsometer). | ||
#Make a post-measurement. Measure the wafer bow again: | #Make a post-stress measurement. Measure the wafer bow again: | ||
#*On the same profilometer as used for the pre-measurement. | #*On the same profilometer as used for the pre-measurement. | ||
#*With the same recipe as used for the pre-mesurement. | #*With the same recipe as used for the pre-mesurement. | ||
#*On the same position(s) on the wafer as the pre-measurement . | #*On the same position(s) on the wafer as the pre-measurement. | ||
#Use the program for stress measurement in the profilometer software | #Use the program for stress measurement in the profilometer software. Use both the pre-stress measurement and the post-stress measurement. | ||
#*The profiler program asks for substrate elasticity (choose the substrate type | #*The profiler program asks for a substrate elasticity (choose the substrate type, e.g. Si(100)), substrate thickness, film thickness and the name of the pre-stress measurement. | ||
==When the deposition is on both sides of the wafer== | ==When the deposition is on both sides of the wafer== | ||