Specific Process Knowledge/Thin film deposition/Deposition of Copper: Difference between revisions
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! E-beam evaporation (Alcatel) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ||
! E-beam evaporation (Leybold) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Leybold|Leybold]]) | ||
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Revision as of 14:37, 5 February 2009
Copper can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | E-beam evaporation (Leybold) | |
|---|---|---|
| Batch size |
|
|
| Pre-clean | RF Ar clean | Ar ion bombartment |
| Layer thickness | 10Å to 0.5µm | 10Å to 1500Å |
| Deposition rate | 2Å/s to 15Å/s | 1Å/s to 5Å/s |
Studies of Cu deposition processes
Roughness of Cu layers - Roughness of Cu layers deposited with Alcatel