Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 02 processing: Difference between revisions
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==Substrate centring== | ==Substrate centring and flat alignment== | ||
During substrate detection, the sample is scanned along the X- and Y-axes, as well as diagonally. From these measurements, the diameter of the substrate is calculated, as well as the stage position matching the center of the substrate. This stage position will be the default origin for the subsequent exposure. | During substrate detection, the sample is scanned along the X- and Y-axes, as well as diagonally. From these measurements, the diameter of the substrate is calculated, as well as the stage position matching the center of the substrate. This stage position will be the default origin for the subsequent exposure. | ||
At the end of substrate detection, the sample is scanned twice along the flat (bottom side for chips/plates), in order to determine the substrate rotation. This angle will be presented in the exposure panel along with the option to expose the design rotated in order to compensate for this angle, i.e. aligned to the flat. | At the end of substrate detection, the sample is scanned twice along the flat (bottom side for chips/plates), in order to determine the substrate rotation. This angle will be presented in the exposure panel along with the option to expose the design rotated in order to compensate for this angle, i.e. aligned to the flat. | ||