Specific Process Knowledge/Pattern Design: Difference between revisions
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* For '''E-beam lithography''' you need to prepare a set of files (GDS, V30, sdf, jdf and mgn files). For details about how to prepare the files for E-beam lithography, please see [[Specific_Process_Knowledge/Lithography/EBeamLithography/FilePreparation#FilePreparation|File preparation]]. For details about how to make alligned E-beam patterns, please have at look at [[Specific_Process_Knowledge/Lithography/EBeamLithography/JBX9500Manual#Design_of_global_marks_and_chip_marks|Design of global marks and chip marks]] | * For '''E-beam lithography''' you need to prepare a set of files (GDS, V30, sdf, jdf and mgn files). For details about how to prepare the files for E-beam lithography, please see [[Specific_Process_Knowledge/Lithography/EBeamLithography/FilePreparation#FilePreparation|File preparation]]. For details about how to make alligned E-beam patterns, please have at look at [[Specific_Process_Knowledge/Lithography/EBeamLithography/JBX9500Manual#Design_of_global_marks_and_chip_marks|Design of global marks and chip marks]] | ||
* For '''laser cutting''' the layout file has to be saved as a DXF file that is uploaded to the equipment computer | * For '''laser cutting''' the layout file has to be saved as a DXF file that is uploaded to the equipment computer. | ||
* For '''UV-lithography''' it is necescary to have a physical masks produced based on the layout file. The file format has to be CIF or GDS. For more details see below [[Specific_Process_Knowledge/Pattern_Design#Mask Fabrication for UV-lithography|Mask Fabrication for UV-lithography]]. | * For '''UV-lithography''' it is necescary to have a physical masks produced based on the layout file. The file format has to be CIF or GDS. For more details see below [[Specific_Process_Knowledge/Pattern_Design#Mask Fabrication for UV-lithography|Mask Fabrication for UV-lithography]]. | ||