Specific Process Knowledge/Etch/Wet Titanium Etch

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Ething of Titanium can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done either with ICP using Chlorine chemistry or with IBE by sputtering with Ar ions.

Wet etching of Titanium

Fume hood 01 and 02 in Cleanroom D-3 for working with acids and bases.
Wet etching of titanium can be done in beakers with BHF or RCA1 mix in a beaker in one of these fume hoods

We have two solutions for wet titanium etching:

1. BHF (beaker in fumehood)
2. Cold RCA1 (beaker in fumehood)

Etching titanium in BHF or RCA1 mix is made by making your own solution in a beaker in either Fumehood 01 or 02 in Cleanroom D-3. You can see the APV here.

Comparing the two solutions

	BHF	Cold RCA1
General description	Etch of titanium with or without photoresist mask.	Etch of titanium (as stripper or with eagle resist).
Link to safety APV and KBA	see APV here See SDS here (requires Kemibrug login)	see APV here
Chemical solution	HF:NH4F	NH3OH:H2O2:H2O - 1:1:5
Process temperature	Room temperature	Room temperature
Possible masking materials	Photoresist (1.5 µm AZ5214E)	Eagle resist
Etch rate	Not known (it bubbles while etching)	Not known
Batch size	1-5 wafers in beaker	1-5 wafers in beaker
Size of substrate	Any size and number that can go inside the beaker in use.	Any size and number that can go inside the beaker in use.
Allowed materials	Practically no restrictions when used in beaker. Make sure to use a plastic beaker, since glass will be attacked by BHF/HF. Make a note on the beaker of which materials have been processed.	Practically no restrictions when used in beaker. Make a note on the beaker of which materials have been processed.