Specific Process Knowledge/Back-end processing/Polisher CMP: Difference between revisions

Revision as of 11:48, 1 February 2019 view source Choi (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, danchip 641 edits →Polisher (CMP) ← Older edit		Revision as of 08:14, 21 April 2020 view source Rkch (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers 284 edits →Polisher (CMP) Newer edit →
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	[[image:Cmp_picture.jpg\|400px\|right\|thumb\|The Logitech PM5 Polisher/Lapper in cleanroom A-5]]		[[image:Cmp_picture.jpg\|400px\|right\|thumb\|The Logitech PM5 Polisher/Lapper in cleanroom A-5]]

	The Logitech Orbis Polisher (CMP) is for polishing wafers (removing material in the nm range) it is not for thinning down wafers or other substrates.		The Logitech Orbis Polisher (CMP) is for polishing wafers (removing material in the nm range) it is not for thinning down wafers or other substrates. After CMP it is recommended to use the '''[http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning/Post_CMP_Cleaner Post CMP Cleaner]''' to clean the sample for slurry residues left by the CMP.