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Specific Process Knowledge/Etch/ICP Metal Etcher/Chromium: Difference between revisions

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===Chromium etch in ICP metal on a thick glass substrate===
===Chromium etch in ICP metal on a thick glass substrate===
The Chromium etch has ONLY been carried out on the following substrate stack:
The Chromium etch has ONLY been carried out on the following substrate stack:
The Chromium is sputter deposited onto a 2" quartz wafer and pattered by e-beam with Zep520A resist.
The Chromium is sputter deposited onto a 2" quartz wafer and patterned by e-beam with Zep520A resist.
This 2" QZ wafer is bonded with crystal bond to a 65mmx65mm quartz plate with the thickness: 6.35mm.
This 2" QZ wafer is bonded with crystal bond to a 65mmx65mm quartz plate with the thickness: 6.35mm.
This QZ plate is bonded to a Si wafer.
This QZ plate is bonded to a Si wafer.
{| border="2" cellpadding="2" cellspacing="1" style="text-align:center;"
{| border="2" cellpadding="2" cellspacing="1" style="text-align:center;"
|+ '''Cr etch''' by bghe@danchip
|+ '''Cr etch''' by bghe@nanolab
|-
|-
! Parameter
! Parameter