Specific Process Knowledge/Thin film deposition/Temescal: Difference between revisions
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==Particulates on the films== | ==Particulates on the films== | ||
''Testing December 2018 by Rebecca Ettlinger and Evgeniy Shkondin'' | ''Testing November/December 2018 by Rebecca Ettlinger and Evgeniy Shkondin'' | ||
The number of particles that end up on the film depends on the material being deposited and the deposition parameters as well as the cleanliness of the wafer and the chamber. We have done some tests to compare particulates on the films in the Temescal and the Wordentec for different materials and process conditions. | The number of particles that end up on the film depends on the material being deposited and the deposition parameters as well as the cleanliness of the wafer and the chamber. We have done some tests to compare particulates on the films in the Temescal and the Wordentec for different materials and process conditions. | ||
Main conclusions: | Main conclusions: | ||
*Optimizing the deposition parameters can reduce the number of particles. If you would like to optimize the process for a material that you are working with, please contact the process responsible staff. | *A lower deposition rate gave fewer particles for both TiAu films and Al films (comparison of 10 Å/s and 2 Å/s). | ||
*Optimizing the deposition parameters (the soak and rise times and perhaps power level) can reduce the number of particles. If you would like to optimize the process for a material that you are working with, please contact the process responsible staff. | |||
*For TiAu layers, there are relatively many particles compared to, e.g., Al or Ni. Specifically for Au, this is apparently due to carbon contamination of the target material, which is reduced by long soaking times before the deposition starts. | *For TiAu layers, there are relatively many particles compared to, e.g., Al or Ni. Specifically for Au, this is apparently due to carbon contamination of the target material, which is reduced by long soaking times before the deposition starts. | ||
*There will be more particles on the film if the loading of the wafer does not go smoothly, so it is worthwhile to be careful and use the vacuum tweezers if possible. | *There will be more particles on the film if the loading of the wafer does not go smoothly, so it is worthwhile to be careful and use the vacuum tweezers if possible. | ||
*There are fewer particles from just loading/pumping/venting/unloading wafers with no processing in the Wordentec than the Temescal, at least when tested in Nov/Dec 2018. | |||
The full results of the testing can be found here. | The full results of the testing can be found here [[:File:particles-pinholes test Temescal.pptx]]. | ||
== Process information == | == Process information == | ||