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Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions

Reet (talk | contribs)
Reet (talk | contribs)
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* For thicknesses above 600 nm permission is required
* For thicknesses above 600 nm permission is required
* An adhesion layer (of Cr or Ti) is recommended under Au.
* Takes approx. 20 min to pump down.
* Takes approx. 20 min to pump down.
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* For thicknesses above 600 nm permission is required
* For thicknesses above 600 nm permission is required
* An adhesion layer (of Cr or Ti) is recommended under Au.
* Takes approx. 1 hour to pump down.
* Takes approx. 1 hour to pump down.
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* For thicknesses above 200 nm permission is required
* For thicknesses above 200 nm permission is required
* An adhesion layer (of Cr or Ti) is recommended under Au.
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* Used for gold sputter coating of samples before SEM inspection
* Used for gold sputter coating of samples before SEM inspection