Jump to content

Specific Process Knowledge/Characterization/Sample imaging: Difference between revisions

← Older editNewer edit →
VisualWikitext
Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,565 edits
Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,565 edits
Line 59: Line 59:
[[Specific_Process_Knowledge/Characterization/SEM_Supra_2| SEM Supra 2]],  
[[Specific_Process_Knowledge/Characterization/SEM_Supra_2| SEM Supra 2]],  
[[Specific_Process_Knowledge/Characterization/SEM_Supra_3| SEM Supra 3]],  
[[Specific_Process_Knowledge/Characterization/SEM_Supra_3| SEM Supra 3]],  
[[Specific_Process_Knowledge/Characterization/SEM:_Scanning_Electron_Microscopy/LEO|SEM-LEO]], )
[[Specific_Process_Knowledge/Characterization/SEM_LEO| SEM Leo]],  
 
[[Specific_Process_Knowledge/Characterization/SEM_Tabletop_1| SEM Tabletop 1]])
[[Specific_Process_Knowledge/Characterization/SEM_Tabletop_1| SEM Tabletop 1]],


|Atomic force microscope  
|Atomic force microscope  
Line 198: Line 197:
|
|
|Samples have to be (semi)conducting, but may have a thin (> ~ 5 µm) layers of non-conducting materials on top.
|Samples have to be (semi)conducting, but may have a thin (> ~ 5 µm) layers of non-conducting materials on top.
:Non-conducting samples (thick polymer, qaurtz or glass samples) can be inspected in the FEI-SEM or one of the Supra-SEMs.
|Sample dimensions have to be smaller than stylus dimensions
|Sample dimensions have to be smaller than stylus dimensions
|Sample dimensions have to be smaller than tip dimensions
|Sample dimensions have to be smaller than tip dimensions
Line 222: Line 220:
*One 50 mm wafer
*One 50 mm wafer
*One 100 mm wafer  
*One 100 mm wafer  
:(not possible to inspect entire wafer in JEOL-SEM)
*One 150 mm wafer  
*One 150 mm wafer  
:(not JEOL-SEM)
*One 2000 mm wafer  
*One 2000 mm wafer  
:(only Supra 60VP, not possible to inspect entire wafer)
:(only Supra 2, not possible to inspect entire wafer)
|
|
*One small sample
*One small sample
Line 249: Line 245:
*All sample materials, expect:  
*All sample materials, expect:  
Samples that may disintegrate, produce dust/particles or degas (e.g. wet polymers and powders. Samples with resist or polymer should be properly baked and outgassed before SEM inspection
Samples that may disintegrate, produce dust/particles or degas (e.g. wet polymers and powders. Samples with resist or polymer should be properly baked and outgassed before SEM inspection
*Graphene and carbon nanotubes
:(Only FEI, use special sample holder)
*Non-conducting samples
:(Use low vacuum detector in SEM-FEI or VPSE detector in SEM-Zeiss)
|
|
*All standard cleanroom materials, except samples that might damage or stick to the tip.
*All standard cleanroom materials, except samples that might damage or stick to the tip.
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Characterization/Sample_imaging"