Specific Process Knowledge/Etch: Difference between revisions
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*[[/KOH Etch|KOH Etch]] - ''Anisotropic silicon etch'' | *[[/KOH Etch|KOH Etch]] - ''Anisotropic silicon etch'' | ||
*[[/Wet Polysilicon Etch|Wet Polysilicon Etch]] - ''Isotropic silicon etch'' | *[[/Wet Polysilicon Etch|Wet Polysilicon Etch]] - ''Isotropic silicon etch'' | ||
*[[/Wet Aluminium Etch|Wet | *[[/Wet Aluminium Etch|Wet Aluminium Etch]] | ||
Revision as of 09:18, 1 November 2007
Choose material to be etched
- Aluminium
- Chromium
- Titanium
- Gold
- Platin
- Polymer
- Silicon
- Silicon Nitride
- Silicon Oxide
- Bulk Glass - Borofloat (pyrex) and fused silica (quartz)
Choose a dry etch equipment
Choose a wet etch
- Wet Silicon Nitride Etch
- Wet Silicon Oxide Etch (BHF)
- KOH Etch - Anisotropic silicon etch
- Wet Polysilicon Etch - Isotropic silicon etch
- Wet Aluminium Etch