Specific Process Knowledge/Back-end processing/Polisher CMP: Difference between revisions
| Line 8: | Line 8: | ||
== Polisher/Lapper == | == Polisher/Lapper == | ||
[[image: | [[image:Cmp_picture.jpg|400px|right|thumb|The Logitech PM5 Polisher/Lapper]] | ||
The Logitech Orbis Polisher (CMP) is for polishing wafers (removing material in the nm range) it is not for thinning down wafers or other substrates. | The Logitech Orbis Polisher (CMP) is for polishing wafers (removing material in the nm range) it is not for thinning down wafers or other substrates. | ||
Revision as of 10:11, 29 November 2018
Feedback to this page: click here
THIS PAGE IS UNDER CONSTRUCTION
Polisher/Lapper
The Logitech Orbis Polisher (CMP) is for polishing wafers (removing material in the nm range) it is not for thinning down wafers or other substrates.
The user manual, user APV, technical information and contact information can be found in LabManager: