Specific Process Knowledge/Back-end processing/Polisher CMP: Difference between revisions
| Line 17: | Line 17: | ||
<!-- give the link to the equipment info page in LabManager: --> | <!-- give the link to the equipment info page in LabManager: --> | ||
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach= | [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=169 The Logitech Orbis (CMP)in LabManager] | ||
Revision as of 09:56, 29 November 2018
Feedback to this page: click here
THIS PAGE IS UNDER CONSTRUCTION
Polisher/Lapper
The Logitech Orbis Polisher (CMP) is for polishing wafers (removing material in the nm range) it is not for thinning down wafers or other substrates.
The user manual, user APV, technical information and contact information can be found in LabManager: