Specific Process Knowledge/Back-end processing/Polishing machine: Difference between revisions
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[[image:Logitech pm5 1.jpg|400px|right|thumb|The Logitech PM5 Polisher/Lapper]] | [[image:Logitech pm5 1.jpg|400px|right|thumb|The Logitech PM5 Polisher/Lapper]] | ||
The Logitech | The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates. | ||
'''The user manual, user APV, technical information and contact information can be found in LabManager:''' | '''The user manual, user APV, technical information and contact information can be found in LabManager:''' |
Revision as of 09:55, 29 November 2018
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Polisher/Lapper
The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates.
The user manual, user APV, technical information and contact information can be found in LabManager:
The Logitech PM5 Polisher/Lapper in LabManager
Equipment | Polisher/Lapper | |
---|---|---|
Purpose |
Thinning of substrates of |
|
Performance | Thinning |
|
Polishing |
| |
Process parameter range | Polishing liquid |
|
Polishing cloths |
| |
Rotation speed |
| |
Arm sweep |
| |
Substrates | Batch size |
|
Allowed materials |
|