Specific Process Knowledge/Etch/DryEtchProcessing/Comparison: Difference between revisions
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! style="background:WhiteSmoke; color:black" | Clamping | ! style="background:WhiteSmoke; color:black" | Clamping/wafer size | ||
| style="background:WhiteSmoke; color:black" | Electrostatic clamping (semco electrode) | | style="background:WhiteSmoke; color:black" | Electrostatic clamping (semco electrode)<br> Wafer size 4" | ||
| style="background:WhiteSmoke; color:black" | Electrostatic clamping (TDESC) | | style="background:WhiteSmoke; color:black" | Electrostatic clamping (TDESC)<br> Wafer size 4" | ||
| style="background:WhiteSmoke; color:black" colspan="2" | Electrostatic clamping (TDESC) | | style="background:WhiteSmoke; color:black" colspan="2" | Electrostatic clamping (TDESC)<br> Wafer size 4" | ||
| style="background:WhiteSmoke; color:black" | Electrostatic clamping (TDESC) | | style="background:WhiteSmoke; color:black" | Electrostatic clamping (TDESC)<br> Wafer size 6" | ||
| style="background:WhiteSmoke; color:black" | No clamping | | style="background:WhiteSmoke; color:black" | No clamping<br> Sample size up to 4" | ||
| style="background:WhiteSmoke; color:black" | Mechanical clamping (weighted clamp with ceramic fingers) | | style="background:WhiteSmoke; color:black" | Mechanical clamping (weighted clamp with ceramic fingers)<br> Wafer size 4" | ||
| style="background:WhiteSmoke; color:black" | Mechanical clamping | | style="background:WhiteSmoke; color:black" | Mechanical clamping <br> Wafer sizes 2"/4"/6"/8" | ||
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! style="background:lightgrey; color:black" | Gasses | ! style="background:lightgrey; color:black" | Gasses | ||