Specific Process Knowledge/Etch/Etching of Chromium: Difference between revisions

Revision as of 14:50, 9 November 2009

Etching of Chromium

Fume hood: positioned in cleanroom 2.
Wet Etch of Chromium can take place in a beaker in this fume hood

Etching of chromium is done wet at Danchip making your own set up in a beaker in a fume hood - preferably in cleanroom 2 or 4. We have two solution for this:

HNO $_{3}$ :H $_{2}$ O:cerisulphate - 90ml:1200ml:15g - standard at Danchip
Commercial chromium etch

Etch rate are depending on the level of oxidation of the metal.

Overview of the data for the chromium etches

	Chromium etch 1	Chromium etch 2
General description	Etch of chromium	Etch of chromium
Chemical solution	HNO $_{3}$ :H $_{2}$ O:cerisulphate - 90ml:1200ml:15g	.
Process temperature	Room temperature	.
Possible masking materials	Photoresist (1.5 µm AZ5214E)	.
Etch rate	~40-100 nm/min	.
Batch size	1-25 wafers at a time	.
Size of substrate	4" wafers	.
Allowed materials	No restrictions. Make a note on the bottle of which materials have been processed.	.

@@ Line 23: / Line 23: @@
 | '''Chemical solution'''
 |HNO<math>_3</math>:H<math>_2</math>O:cerisulphate  - 90ml:1200ml:15g
-|Commercial chromium etch
+|.
-CE 8002-A
 |-
 | '''Process temperature'''
 |Room temperature
-|Room temperature
+|.
 |-
@@ Line 37: / Line 36: @@
 Photoresist (1.5 µm AZ5214E)
 |
-Photoresist (1.5 µm AZ5214E)
+.
 |-
 |'''Etch rate'''
@@ Line 43: / Line 42: @@
 ~40-100 nm/min
 |
-~10-20 nm/min
+.
 |-
 |'''Batch size'''
@@ Line 49: / Line 48: @@
 -25 wafers at a time
 |
--25 wafer at a time
+.
 |-
 |'''Size of substrate'''
@@ Line 55: / Line 54: @@
 " wafers
 |
-" wafers
+.
 |-
 |'''Allowed materials'''
@@ Line 62: / Line 61: @@
 Make a note on the bottle of which materials have been processed.
 |
-No restrictions.
+.
-Make a note on the bottle of which materials have been processed.
 |-
 |}