Specific Process Knowledge/Characterization

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Overview of characteristics and where to measure it

Optical Micro- scopes

SEM (incl. EDX)

AFM

Stylus profiler

Optical profiler

Filmtek (reflec- tometer)

Ellip- someter

Thickness stylus

XPS

PL mapper

4-point probe

Probe station

XRD

Life time scanner

Drop shape analyser

Hardness tester

Differential Scanning Calorimeter DSC

Surfscan

Thin film thickness

x 1)

x 1)

x 2)

x 2)

x

x

x

x 5)

x 3)

x

Defects

x

x

Wafer thickness

x 1)

x 1)

x

Step coverage

x 1)

x 1)

Particles

x

x

x

x

Element analysis

x

x

x 4)

x 4)

Surface roughness

x

x

x

Deposition uniformity

x

x

x

Film stress

x

x

Refractive index

x

x

Reflectivity

x

x

(x)

Resistivity

x

Breakdown voltage

Electrical conductivity

x

Thermal conductivity

Optical gap

x

x

Crystalinity

x

x

Charge carrier life time

x

Contact angle hydrophobic/hydrophillic

x

Material Hardness

x

Voids in wafer bonding

x

Phase changes

x

1. Using the cross section method
2. Using the create step method
3. With known resistivity
4. Composition information for crystalline materials
5. Only single layer

Choose characterization topic

• Element analysis
• Measurement of film thickness and optical constants
• Photoluminescence mapping
• Sample imaging
• Sample preparation for inspection
• Stress measurement
• Hardness measurement
• Wafer thickness measurement
• Topographic measurement

• Contact angle measurement
• Four-Point Probe (Resistivity measurement)
• Carrier density (doping) profiler
• Scanning Electron Microscopy

Choose equipment

AFM

• AFM - Atomic Force Microscopy

Element analysis

• SEM with EDX
• XPS-ThermoScientific

Optical and stylus profilers

• Optical Profiler (Sensofar)
• Dektak XTA_new
• Dektak 8 stylus profiler
• III V Profiler

Optical microscopes

• Optical microscope

Optical characterization

• Ellipsometer
• Filmtek 4000
• Prism Coupler
• PL mapper - Photoluminescence mapper
• Lifetime scanner MDPmap

SEMs at CEN

• FIB-SEM FEI QUANTA 200 3D
• Dual Beam FEI Helios Nanolab 600
• SEM FEI Nova 600 NanoSEM
• SEM FEI Quanta 200 ESEM FEG
• SEM Inspect S

SEMs at Danchip

• SEM Comparison page
• SEM LEO
• SEM Supra 1
• SEM Supra 2
• SEM Supra 3
• SEM Tabletop 1

TEMs at CEN

• Titan ATEM
• Titan ETEM
• Tecnai TEM

Various

• Drop Shape Analyzer

• 4-Point Probe

• Thickness Measurer
• DSC Perkin Elmer
• Probe station
• Hardness tester
• KLA-Tencor Surfscan 6420
• III-V ECV-profiler (Electrochemical Capacitance-Voltage carrier density profiler)
• X-Ray Diffractometer
• XRD SmartLab