Specific Process Knowledge/Etch/KOH Etch/ProcessInfo: Difference between revisions
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It is possible to protect the backside of the wafer against KOH. | It is possible to protect the backside of the wafer against KOH. | ||
Two different solutions has been used: | Two different solutions has been used: | ||
* Using special wafer holder. | * Using special wafer holder.[[File:Tandem4.png|400px]][[File:Tandem4 b.png|400px]][[:File:AMMT_PI_WETandem.pdf]] | ||
* using spin-on film (PtoTec B3) | * using spin-on film (PtoTec B3) | ||
Please ask the Wet chemistry team for more information. | |||
==Theory== | ==Theory== | ||