Specific Process Knowledge/Etch/KOH Etch/ProcessInfo: Difference between revisions
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== Backside protection == | == Backside protection == | ||
It is possible to protect the backside of the wafer against KOH. | |||
Two different solutions has been used: | |||
* Using special wafer holder. | |||
* using spin-on film (PtoTec B3) | |||
==Theory== | ==Theory== | ||