Specific Process Knowledge/Thin film deposition/Temescal: Difference between revisions
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==The e-beam and the Cu hearth== | ==The e-beam and the Cu hearth== | ||
[[File:Cu hearth.jpg|200px| | [[File:Cu hearth 2.jpg|100px|left|thumb|Empty 6-pocket Temescal copper heath (from Fil-Tech)]] | ||
[[File:Cu hearth.jpg|200px|right|thumb|E-beam impinging on the target from the filament and a 6-pocket Temescal copper hearth and filament assembly enclosed by shields (from Scotech)]] | |||
At the start of the deposition and for every 100 nm, please check that the e-beam hits the target material that you would like to evaporate rather than the heath next to the pocket or the bottom of the pocket. I.e., check that the e-beam sweep has not shifted, which could happen if the filament assembly has been distorted by heat for example, and also check that there is enough material in the pocket, so that you do not burn a hole in the bottom of the pocket. If you burn a hole in the bottom of the pocket, cooling water may leak into the chamber and it may flood! | At the start of the deposition and for every 100 nm, please check that the e-beam hits the target material that you would like to evaporate rather than the heath next to the pocket or the bottom of the pocket. I.e., check that the e-beam sweep has not shifted, which could happen if the filament assembly has been distorted by heat for example, and also check that there is enough material in the pocket, so that you do not burn a hole in the bottom of the pocket. If you burn a hole in the bottom of the pocket, cooling water may leak into the chamber and it may flood! | ||
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== Process information == | == Process information == | ||