Specific Process Knowledge/Characterization: Difference between revisions
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==Overview of characteristics and where to measure it== | ==Overview of characteristics and where to measure it== | ||
{| {{table}} | {| {{table}} | ||
| align="center" style="background:#f0f0f0;"|'''''' | | width="50" align="center" style="background:#f0f0f0;"|'''''' | ||
| align="center" style="background:#f0f0f0;"|'''Microscopes''' | | width="50" align="center" style="background:#f0f0f0;"|'''Microscopes''' | ||
| align="center" style="background:#f0f0f0;"|'''SEM (incl. EDX)''' | | width="50" align="center" style="background:#f0f0f0;"|'''SEM (incl. EDX)''' | ||
| align="center" style="background:#f0f0f0;"|'''AFM''' | | width="50" align="center" style="background:#f0f0f0;"|'''AFM''' | ||
| align="center" style="background:#f0f0f0;"|'''Stylus profiler''' | | width="50" align="center" style="background:#f0f0f0;"|'''Stylus profiler''' | ||
| align="center" style="background:#f0f0f0;"|'''Optical profiler''' | | width="50" align="center" style="background:#f0f0f0;"|'''Optical profiler''' | ||
| align="center" style="background:#f0f0f0;"|'''Filmtek (reflectometer)''' | | width="50" align="center" style="background:#f0f0f0;"|'''Filmtek (reflectometer)''' | ||
| align="center" style="background:#f0f0f0;"|'''Ellipsometer''' | | width="50" align="center" style="background:#f0f0f0;"|'''Ellipsometer''' | ||
| align="center" style="background:#f0f0f0;"|'''Thickness stylus''' | | width="50" align="center" style="background:#f0f0f0;"|'''Thickness stylus''' | ||
| align="center" style="background:#f0f0f0;"|'''XPS''' | | width="50" align="center" style="background:#f0f0f0;"|'''XPS''' | ||
| align="center" style="background:#f0f0f0;"|'''PL mapper''' | | width="50" align="center" style="background:#f0f0f0;"|'''PL mapper''' | ||
| align="center" style="background:#f0f0f0;"|'''4-point probe''' | | width="50" align="center" style="background:#f0f0f0;"|'''4-point probe''' | ||
| align="center" style="background:#f0f0f0;"|'''Probe station''' | | width="50" align="center" style="background:#f0f0f0;"|'''Probe station''' | ||
| align="center" style="background:#f0f0f0;"|'''XRD''' | | width="50" align="center" style="background:#f0f0f0;"|'''XRD''' | ||
| align="center" style="background:#f0f0f0;"|'''Life time scanner''' | | width="50" align="center" style="background:#f0f0f0;"|'''Life time scanner''' | ||
| align="center" style="background:#f0f0f0;"|'''Drop shape analyser''' | | width="50" align="center" style="background:#f0f0f0;"|'''Drop shape analyser''' | ||
| align="center" style="background:#f0f0f0;"|'''Hardness tester''' | | width="50" align="center" style="background:#f0f0f0;"|'''Hardness tester''' | ||
|- | |- | ||
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Revision as of 14:13, 21 September 2018
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Overview of characteristics and where to measure it
' | Microscopes | SEM (incl. EDX) | AFM | Stylus profiler | Optical profiler | Filmtek (reflectometer) | Ellipsometer | Thickness stylus | XPS | PL mapper | 4-point probe | Probe station | XRD | Life time scanner | Drop shape analyser | Hardness tester |
Thin film thickness | x 1) | x 1) | x 2) | x 2) | x | x | x | x 3) | x | |||||||
Defects | x | x | ||||||||||||||
Wafer thickness | x 1) | x 1) | x | |||||||||||||
Step coverage | x 1) | x 1) | ||||||||||||||
Particles | x | x | x | |||||||||||||
Element analysis | x | x | x 4) | x 4) | ||||||||||||
Surface roughness | x | x | x | |||||||||||||
Deposition uniformity | x | x | x | |||||||||||||
Film stress | x | x | ||||||||||||||
Refractive index | x | x | ||||||||||||||
Reflectivity | x | x | (x) | |||||||||||||
Resistivity | x | |||||||||||||||
Breakdown voltage | ||||||||||||||||
Electrical conductivity | x | |||||||||||||||
Thermal conductivity | ||||||||||||||||
Optical gap | x | x | ||||||||||||||
Crystalinity | x | |||||||||||||||
Charge carrier life time | x | |||||||||||||||
Contact angle hydrofob/hydrofil | x | |||||||||||||||
Material Hardness | x | |||||||||||||||
- Using the cross section method
- Using the create step method
- With known resistivity
- Composition information
Choose characterization topic
- Element analysis
- Measurement of film thickness and optical constants
- Photoluminescence mapping
- Sample imaging
- Sample preparation for inspection
- Stress measurement
- Hardness measurement
- Wafer thickness measurement
- Topographic measurement
- Contact angle measurement
- Four-Point Probe (Resistivity measurement)
- Carrier density (doping) profiler
- Scanning Electron Microscopy
Choose equipment
AFM
Element analysis
Optical and stylus profilers
Optical microscopes
Optical characterization
- Ellipsometer
- Filmtek 4000
- Prism Coupler
- PL mapper - Photoluminescence mapper
- Lifetime scanner MDPmap
SEM's at CEN
- FIB-SEM FEI QUANTA 200 3D
- Dual Beam FEI Helios Nanolab 600
- SEM FEI Nova 600 NanoSEM
- SEM FEI Quanta 200 ESEM FEG
- SEM Inspect S