Specific Process Knowledge/Characterization: Difference between revisions

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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Characterization click here]'''  
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Characterization click here]'''  


 
{| {{table}}
| align="center" style="background:#f0f0f0;"|''''''
| align="center" style="background:#f0f0f0;"|'''Microscopes'''
| align="center" style="background:#f0f0f0;"|'''SEM (incl. EDX)'''
| align="center" style="background:#f0f0f0;"|'''AFM'''
| align="center" style="background:#f0f0f0;"|'''Stylus profiler'''
| align="center" style="background:#f0f0f0;"|'''Optical profiler'''
| align="center" style="background:#f0f0f0;"|'''Filmtek (reflectometer)'''
| align="center" style="background:#f0f0f0;"|'''Ellipsometer'''
| align="center" style="background:#f0f0f0;"|'''Thickness stylus'''
| align="center" style="background:#f0f0f0;"|'''XPS'''
| align="center" style="background:#f0f0f0;"|'''PL mapper'''
| align="center" style="background:#f0f0f0;"|'''4-point probe'''
| align="center" style="background:#f0f0f0;"|'''Probe station'''
| align="center" style="background:#f0f0f0;"|'''XRD'''
| align="center" style="background:#f0f0f0;"|'''Life time scanner'''
| align="center" style="background:#f0f0f0;"|'''Drop shape analyser'''
| align="center" style="background:#f0f0f0;"|'''Hardness tester'''
|-
| Thin film thickness||x  1)||x  1)||x  2)||x  2)||x  ||x||x||||||||x  3)||||x||||||
|-
| Defects||x||||||||||||||||||x||||||||||||
|-
| Wafer thickness||x  1)||x  1)||||||||||||x||||||||||||||||
|-
| Step coverage||x  1)||x  1)||||||||||||||||||||||||||||
|-
| Particles||x||x||x||||||||||||||||||||||||||
|-
| Element analysis||||x||||||||||||||x||x  4)||||||x  4)||||||
|-
| Surface roughness||||||x||x||x||||||||||||||||||||||
|-
| Deposition uniformity||||||||||x||x||x||||||||||||||||||
|-
| Film stress||||||||x||||||||||||||||||x||||||
|-
| Refractive index||||||||||||x||x||||||||||||||||||
|-
| Reflectivity||||||||||||x||x||||||(x)||||||||||||
|-
| Resistivity||||||||||||||||||||||x||||||||||
|-
| Breakdown voltage||||||||||||||||||||||||||||||||
|-
| electrical conductivity||||||||||||||||||||||||x||||||||
|-
| Thermal conductivity||||||||||||||||||||||||||||||||
|-
| Optical gap||||||||||||||x||||||x||||||||||||
|-
| Crystalinity||||||||||||||||||||||||||x||||||
|-
| Charge carrier life time||||||||||||||||||||||||||||x||||
|-
| Contact angle hydrofob/hydrofil||||||||||||||||||||||||||||||x||
|-
| Hardness measure||||||||||||||||||||||||||||||||x
|-
|
|}


== Choose characterization topic ==
== Choose characterization topic ==

Revision as of 13:43, 20 September 2018

Feedback to this page: click here

' Microscopes SEM (incl. EDX) AFM Stylus profiler Optical profiler Filmtek (reflectometer) Ellipsometer Thickness stylus XPS PL mapper 4-point probe Probe station XRD Life time scanner Drop shape analyser Hardness tester
Thin film thickness x 1) x 1) x 2) x 2) x x x x 3) x
Defects x x
Wafer thickness x 1) x 1) x
Step coverage x 1) x 1)
Particles x x x
Element analysis x x x 4) x 4)
Surface roughness x x x
Deposition uniformity x x x
Film stress x x
Refractive index x x
Reflectivity x x (x)
Resistivity x
Breakdown voltage
electrical conductivity x
Thermal conductivity
Optical gap x x
Crystalinity x
Charge carrier life time x
Contact angle hydrofob/hydrofil x
Hardness measure x

Choose characterization topic

Choose equipment

AFM

Element analysis

Optical and stylus profilers

Optical microscopes

Optical characterization


SEM's at CEN

SEM's at Danchip

TEM's at CEN

Various

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