Specific Process Knowledge/Thin film deposition/Deposition of Zinc: Difference between revisions
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==Zinc deposition== | ==Zinc deposition== | ||
Zinc is tricky to deposit in multiuser vacuum | Zinc is tricky to deposit in a multiuser vacuum system because it has a relatively high vapor pressure at low temperatures, which means that once Zn is inside it easily re-evaporates and contaminates films of other materials. Additionally, the ZnO that always forms on the surface of Zn is much more difficult to evaporate than the Zn itself, so once the ZnO is gone, the Zn within may evaporate extremely rapidly, making it hard to control the deposition rate. For this reason it is better to use sputtering than evaporation to deposit Zn. | ||
Beyond this, Zn cannot be deposited in systems with a cryo pump, as it will completely clog the cryo pumping system. The best solution is therefore a sputter system that is pumped by a turbo pump and where possible Zn contamination is not a problem for other users. | Beyond this, Zn cannot be deposited in systems with a cryo pump, as it will completely clog the cryo pumping system. The best solution is therefore a sputter system that is pumped by a turbo pump and where possible Zn contamination is not a problem for other users. | ||