Specific Process Knowledge/Thin film deposition: Difference between revisions
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[[/Deposition of Molybdenum|Molybdenum]]<br/> | [[/Deposition of Molybdenum|Molybdenum]]<br/> | ||
[[/Deposition of Nickel|Nickel]]<br/> | [[/Deposition of Nickel|Nickel]]<br/> | ||
[[/ | [[/Deposition of Niobium|Niobium]]<br/> | ||
[[/Deposition of Palladium|Palladium]]<br/> | [[/Deposition of Palladium|Palladium]]<br/> | ||
[[/Deposition of Platinum|Platinum]]<br/> | [[/Deposition of Platinum|Platinum]]<br/> |
Revision as of 13:34, 17 September 2018
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Choose material to deposit
Dielectrica | Semicondutors | Metals | Alloys | Transparent conductive oxides | Polymers |
Silicon Nitride - and oxynitride |
Aluminium |
TiW alloy (10%/90% by weight) |
ITO (Tin doped Indium Oxide) |
SU-8 |
Choose deposition equipment
PVD | LPCVD | PECVD | ALD | Coaters | Others
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See the Lithography/Coaters page for coating polymers |
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